Wafer Level Chip Scale Package is fast becoming popular because of its small form factor utilized in such applications as Wifi, Bluetooth and GPS units. The WLCSP is also very cost-effective with a simplified manufacturing process that eliminates the need for the final or package test step.
SV TCL & Associates Probe Company China Japan Europe‘s SpringTouchTM is an ideal & economical solution for WLCSP test with spring pin probes that have the capability to overcome the bump height variation across the wafer. SV TCL also offers an RF option of this technology for WLCSPs that must be tested at a higher frequency.
Other benefits include:
– Crown-shaped Probes
– Pitch Capability as Low as 300µm
– Customized Pins
– Easy Pin Replacement
– Socket Adapter for Single Chip Testing
Contact your SV TCL Representative so we can help you find the right SpringTouch product for your vertical testing needs.